XP1006-BD Datasheet, PDF (5/8 Pages) Mimix Broadband – 8.5-11.0 GHz GaAs MMIC Power Amplifier

8.5-11.0 GHz GaAs MMIC
Power Amplifier
August 2007 - Rev 03-Aug-07
Mechanical Drawing 0.470
(0.018)
1.354
(0.053)
0.170 0.620 1.054
(0.007) (0.024) (0.041)
1.796
(0.071)
4.290
(0.169)
2 34
56
7
2.738
(0.108)
8
4.249
(0.167)
9
P1006-BD
2.145
(0.084)
1
XP1006
MIMIX BROADBAND
10004966
TNO COPYRIGHT 2005
X=4940
Y=4290
10
2.144
(0.084)
18 17 16
15 14
13
0.0
0.470
0.0 _(0.018)
1.054
(0.041)
1.796
(0.071)
0.170 0.620
1.354
(0.007) (0.024)
(0.053)
12
2.738
(0.108)
11
4.249
(0.167)
4.940
(0.194)
(Note: Engineering designator is I0004966)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 13.136 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vgg)
Bond Pad #3 (Vg)
Bond Pad #4 (Vg1a)
Bond Pad #5 (Vd1a)
Bond Pad #6 (Vg2a)
Bond Pad #7 (Vd2a)
Bond Pad #8 (Vg3a)
Bond Pad #9 (Vd3a)
Bond Pad #10 (RF Out)
Bond Pad #11 Vd3b)
Bond Pad #12 (Vg3b)
Bond Pad #13 (Vd2b)
Bond Pad #14 (Vg2b)
Bond Pad #15 (Vd1b)
Bond Pad #16 (Vg1b)
Bond Pad #17 (Vg)
Bond Pad #18 (Vgr)
Pad Locations
RF/DC Pads
RF In/Out
Vgg, Vg, Vg1a, Vd1a, Vg2a, Vg3a,
Vg1b, Vd1b, Vg2b, Vg3b
Vd2a, Vd2b
Vd3a, Vd3b
Size
[mm]
[inches]
0.120x0.200 0.005x0.008
0.100x0.100 0.004x0.004
0.250x0.100 0.010x0.004
0.247x0.153 0.010x0.006
Mimix Asia, Inc. (a subsidiary of Mimix Broadband, Inc.)
3F, 3-2 Industry East IX Road, Science-Based Industrial Park • Hsinchu, Taiwan, R.O.C
Tel [phone] • Fax [phone] • mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
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