XA1000 Datasheet, PDF (5/6 Pages) Mimix Broadband – DC-18.0 GHz GaAs MMIC 5-Bit Digital Attenuator

DC-18.0 GHz GaAs MMIC
5-Bit Digital Attenuator
April 2006 - Rev 24-Apr-06
Mechanical Drawing
1.550
(0.061)
0.947 1.347 1.747
(0.037) (0.053) (0.069)
0.747 1.147 1.547
(0.029) (0.045) (0.061)
234567
A1000
0.858
(0.034)
1
8
0.858
(0.034)
0.0
0.0
2.376
(0.094)
(Note: Engineering designator is I0005359)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.28 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Input 1)
Bond Pad #3 (Input 2)
Bond Pad #4 (Input 3)
Bond Pad #5 (Vss)
Bond Pad #6 (Input 4)
Bond Pad #7 (Input 5)
Bond Pad #8 (RF Out)
Bias Arrangement
Bypass Capacitors - See App Note [2]
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 5 of 6
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.