XA1000-BD Datasheet, PDF (5/6 Pages) Mimix Broadband – DC-18.0 GHz GaAs MMIC 5-Bit Digital Attenuator

DC-18.0 GHz GaAs MMIC
5-Bit Digital Attenuator
August 2007 - Rev 21-Aug-07
Mechanical Drawing
1.550
(0.061)
0.947 1.347 1.747
(0.037) (0.053) (0.069)
0.747 1.147 1.547
(0.029) (0.045) (0.061)
234567
A1000-BD
0.858
(0.034)
1
8
0.858
(0.034)
0.0
0.0
2.376
(0.094)
(Note: Engineering designator is I0005359)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.28 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Input 1)
Bond Pad #3 (Input 2)
Bond Pad #4 (Input 3)
Bond Pad #5 (Vss)
Bond Pad #6 (Input 4)
Bond Pad #7 (Input 5)
Bond Pad #8 (RF Out)
Bias Arrangement
Bypass Capacitors - See App Note [2]
Mimix Asia, Inc. (a subsidiary of Mimix Broadband, Inc.)
3F, 3-2 Industry East IX Road, Science-Based Industrial Park • Hsinchu, Taiwan, R.O.C
Tel [phone] • Fax [phone] • mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
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