CMM1110 Datasheet, PDF (5/7 Pages) Mimix Broadband – 2.0-18.0 GHz GaAs MMIC Low Noise Amplifier

2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
May 2006 - Rev 01-May-06
Mechanical Drawing 0.091
(0.036)
1.100
(0.043)
1.009
2
(0.040)
0.949
(0.037)
3
1.908
(0.075)
4
CMM1110
0.520
1
(0.021)
5
0.520
(0.021)
0.0
0.0
12 11 10
0.869
(0.034)
0.759 0.979
(0.030) (0.039)
9
87 6
1.688 1.908
(0.067) (0.075)
1.383
1.798 2.000
(0.054)
(0.071) (0.079)
(Note: Engineering designator is M420)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.080 x 0.080 (0.003 x 0.003). All RF Bond Pads are 0.180 x 0.080 (0.007 x 0.003).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.364 mg
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd1)
Bond Pad #4 (Vd2)
Bond Pad #7 (Rs2-20.0 )
Bond Pad #5 (RF Out) Bond Pad #8 (Rs2-15 )
Bond Pad #6 (Rs2-32 ) Bond Pad #9 (Vg2)
Bond Pad #10 (Rs1-32 )
Bond Pad #11 (Rs1-20 )
Bond Pad #12 (Rs1-15 )
Bias Arrangement
Vd1,2
Bypass Capacitors - See App Note [2]
2
3
4
RF In 1
5 RF Out
12 11 10
9
87 6
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 5 of 7
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
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