XR1007-BD_08 Datasheet, PDF (4/8 Pages) Mimix Broadband – 11.0-17.0 GHz GaAs MMIC

11.0-17.0 GHz GaAs MMIC
Receiver
October 2008 - Rev 13-Oct-08
Mechanical Drawing
2.000
(0.079)
0.881
(0.035)
2
1.615
(0.064)
1
1.681
(0.066)
2.081
(0.082)
3
4
R1007-BD
5
1.625
(0.064)
10
9
0.0
8
7
6
0.0
0.481
0.881
(0.019)
(0.035)
1.681
(0.066)
2.081 2.281
(0.082) (0.090)
2.700
(0.106)
(Note: Engineering designator is 14REC0607)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.97 mg.
Bond Pad #1 (RF) Bond Pad #3 (IF1) Bond Pad #5 (LO) Bond Pad #7 (Vg4) Bond Pad #9 (Vg2)
Bond Pad #2 (Vd1) Bond Pad #4 (Vd3) Bond Pad #6 (Vg3) Bond Pad #8 (IF2) Bond Pad #10 (Vg1)
Bias Arrangement
Vd1
IF1
2
3
4
RF 1
Vd3
5 _LO
Bypass Capacitors - See App Note [2]
XR1007
10
9
Vg1,2
8
7
6
IF2
Vg3
Vg4
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 4 of 8
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
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