XP1024-BD Datasheet, PDF (4/7 Pages) Mimix Broadband – 26.0-31.0 GHz GaAs MMIC Power Amplifier

26.0-31.0 GHz GaAs MMIC
Power Amplifier
April 2007 - Rev 17-Apr-07
Mechanical Drawing
0.107
(0.042)
2.305
(0.091)
2.705
(0.107)
3.106
(0.122)
3.505
(0.138)
3.907
(0.154)
4.107
(0.162)
2.500
(0.098)
2
XP1024-BD
3
4
5
6
78
P1024-BD
0.429
(0.017)
1
9
0.762
(0.030)
0.0
17
16
15
14
13
12
11 10
0.0
1.506 1.905 2.306 2.705 3.106 3.505
4.107
4.900
(0.059) (0.075) (0.091) (0.107) (0.122) (0.138)
(0.162)
(0.193)
3.907
(0.154)
(Note: Engineering designator is 29MPA0373)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 7.595 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vg3a)
Bond Pad #4 (Vd3a)
Bias Arrangement
Vd1
Vg3a,4a
Bond Pad #5 (Vg4a)
Bond Pad #6 (Vd4a)
Bond Pad #7 (VDIFF2)
Bond Pad #8 (VDET2)
Bond Pad #9 (RF Out)
Bond Pad #10 (VDET1)
Bond Pad #11 (VDIFF1)
Bond Pad #12 (Vd4b)
Vd3a,4a
Rdet
VDIFF2
VDET2
Bond Pad #13 (Vg4b)
Bond Pad #14 (Vd3b)
Bond Pad #15 (Vg3b)
Bond Pad #16 (Vg2)
Bond Pad #17 (Vg1)
2
XP1024-BD
33
44
55
66
78
Bypass Capacitors - See App Note [3]
RF In 1
99 RF Out
Vg1,2
17
16
15
14
13
122
1111 1100
Vg3b,4b
Rdet
Vd3b,4b
VDET1
VDIFF1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 4 of 7
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.