XP1019-BD_08 Datasheet, PDF (4/8 Pages) Mimix Broadband – 17.0-24.0 GHz GaAs MMIC

17.0-24.0 GHz GaAs MMIC
Power Amplifier
October 2008 - Rev 10-Oct-08
Mechanical Drawing
1.330
(0.052)
0.840
(0.033)
1.334
(0.053)
1.788
(0.070)
2
3
4
0.683
(0.027)
1
P1019-BD
5
0.683
(0.027)
0.0
0.0
11
10
9
8
76
0.588 0.947
(0.023) (0.037)
1.650 1.930 ^{2.236 2.510}
(0.065) (0.076) ^{(0.088) (0.099)}
2.400
(0.094)
(Note: Engineering designator is 20MPA0723)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads (except Vd3) are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads (and Vd3) are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.07 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vd3)
Bond Pad #5 (RF Out) Bond Pad #7 (Vdet)
Bond Pad #6 (Ref )
Bond Pad #8 (Det)
Bond Pad #9 (Vg3)
Bond Pad #10 (Vg2)
Bond Pad #11 (Vg1)
Bias Arrangement
Vd1
Vd2
Vd3
Bypass Capacitors - See App Note [2]
2
3
4
RF In 1
5 RF Out
11
10
Vg1
Vg2
Vg3
9
8
76
Ref
Vdet
Det
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 4 of 8
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
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