XP1018-BD Datasheet, PDF (4/8 Pages) Mimix Broadband – 37.0-42.0 GHz GaAs MMIC Power Amplifier

37.0-42.0 GHz GaAs MMIC
Power Amplifier
February 2007 - Rev 01-Feb-07
Mechanical Drawing
1.700
(0.067)
0.592
(0.023)
0.992
(0.039)
1.392
(0.055)
2
3
4
2.193
(0.086)
5
P1018-BD
1.099
(0.043)
1
6
0.639
(0.025)
0.0
0.0
10
0.592
(0.023)
9
0.992
(0.039)
8
1.392
(0.055)
7
1.993
(0.078)
2.500
(0.098)
(Note: Engineering designator is 38MPA0725)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.241 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vd3)
Bond Pad #5 (Vd4)
Bond Pad #6 (RF Out)
Bond Pad #7 (Vg4)
Bond Pad #8 (Vg3)
Bond Pad #9 (Vg2)
Bond Pad #10 (Vg1)
Bias Arrangement
Vd2
Vd1
Vd3
Vd4
Bypass Capacitors - See App Note [2]
2
3
4
5
RF In ¹
6 _{RF Out}
Vg1
10
9
8
Vg2
7
Vg3
Vg4
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 4 of 8
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
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