XP1009 Datasheet, PDF (4/6 Pages) Mimix Broadband – 17.0-21.0 GHz GaAs MMIC Power Amplifier

17.0-21.0 GHz GaAs MMIC
Power Amplifier
May 2006 - Rev 10-May-06
Mechanical Drawing
1.280
(0.050)
0.736
1
(0.029)
P1009
2
0.736
(0.029)
0.0
0.0
6
5
4
3
0.785 1.185 1.585
(0.031) (0.047) (0.062)
2.185
(0.086)
3.920
(0.154)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.111 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (RF Out)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd1)
Bond Pad #6 (Vg1)
Bias Arrangement
RF In 1
6
5
4
3
10
Vg1
Vd1
10
Vd2
Vg2
2 RF Out
Bypass Capacitors - See App Note [2]
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 4 of 6
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
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