XP1008 Datasheet, PDF (4/6 Pages) Mimix Broadband – 11.0-16.0 GHz GaAs MMIC Power Amplifier

11.0-16.0 GHz GaAs MMIC
Power Amplifier
May 2006 - Rev 10-May-06
Mechanical Drawing
0.474 0.874
(0.019) (0.034)
1.280
(0.051)
2
3
0.737
1
(0.029)
P1008
4
0.737
(0.029)
0.0
0.0
8
7
6
0.534 0.934 1.334
(0.021) (0.037) (0.053)
5
1.934
(0.076)
3.480
(0.137)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.762 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd1)
Bond Pad #4 (RF Out)
Bond Pad #5 (Vd3)
Bond Pad #6 (Vg3)
Bond Pad #7 (Vd2)
Bond Pad #8 (Vg2)
Bias Arrangement
10
Vg1
Vd1
2
3
Bypass Capacitors - See App Note [2]
RF In 1
4 RF Out
8
7
10
Vg2
Vd2
6
5
10
Vd3
Vg3
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 4 of 6
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
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