XD1005-BD Datasheet, PDF (4/6 Pages) Mimix Broadband – 10.0-40.0 GHz GaAs MMIC Distributed Amplifier

10.0-40.0 GHz GaAs MMIC
Distributed Amplifier
January 2007 - Rev 16-Jan-07
Mechanical Drawing
1.250
(0.049)
1.070
1
(0.042)
D1005-BD
2
0.406
(0.016)
3
0.0
0.0
0.820
1.500
(0.032)
(0.059)
(Note: Engineering designator is 22DSBA0423)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.163 mg
Bond Pad #1 (RF In) Bond Pad #2 (RF Out) Bond Pad #3 (Vd)
Bias Arrangement
RF In ₁
Bypass Capacitors - See App Note [2]
2 ^{RF Out}
3
Vd
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 4 of 6
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
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