CMM0015-BD Datasheet, PDF (4/6 Pages) Mimix Broadband – 2.0-22.0 GHz GaAs MMIC Power Amplifier

2.0-22.0 GHz GaAs MMIC
Power Amplifier
April 2007 - Rev 26-Apr-07
Mechanical Drawing
1.165
(0.046)
CMM0015-BD
2.234
(0.088)
2
1.059
(0.042)
0.377
(0.015)
1
3
0.639
(0.025)
0.0
0.0
6 54
2.135 2.340
(0.084) (0.092)
2.024 2.244
(0.080) (0.088)
(Note: Engineering designator is M430)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.69 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd)
Bond Pad #3 (RF Out)
Bond Pad #4 (Rs-3.5 )
Bond Pad #5 (Rs-4.5 )
Bond Pad #6 (Rs-6.0 )
Bias Arrangement
Vd
Bypass Capacitors - See App Note [2]
2
RF In ¹
3 RF Out
6 54
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 4 of 6
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
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