XQ1004-BD Datasheet, PDF (3/5 Pages) Mimix Broadband – 7.4-8.6 GHz GaAs MMIC Voltage Controlled Oscillator

7.4-8.6 GHz GaAs MMIC
Voltage Controlled Oscillator
April 2007 - Rev 17-Apr-07
Mechanical Drawing
0.566
(0.022)
1.800
(0.071)
3
1.504
2
(0.060)
4
1.105
1
(0.044)
XQ1004-BD ₅
1.504
(0.060)
1.105
(0.044)
Q1004-BD
0.0
6
0.0
0.673
1.350
(0.027)
(0.053)
(Note: Engineering designator is 8OSC0464)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.507 mg.
Bond Pad #1 (Vtune)
Bond Pad #2 (Vee1)
Bond Pad #3 (RF Out)
Bond Pad #4 (Vee2)
Bond Pad #5 (Vee3)
Bond Pad #6 (Vee3)
Bias Arrangement
Vee1
RF Out
3
2
4
Vtune
1
(Maximum 100pF)
XQ1004-BD
5
6
Vee2
Vee3
Vee1
Bypass Capacitors - See App Note [2]
RF Out
Vee2
Vtune
XQ1004-BD
Vee3
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 3 of 5
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.