XP1027-BD Datasheet, PDF (3/5 Pages) Mimix Broadband – 27.0-33.0 GHz GaAs MMIC Power Amplifier

27.0-33.0 GHz GaAs MMIC
Power Amplifier
March 2007 - Rev 27-Mar-07
Mechanical Drawing
3.500
(0.138)
0.961
1.361 1.761
(0.038) (0.054) (0.069)
2
3
4
2.561 2.961 3.361
(0.101) (0.117) (0.132)
5
6
7
P1027-BD
1.274
(0.050)
1
XP1027-BD
8
2.226
(0.088)
0.0
0.0
14
13
12
11
10
9
0.961 1.361 1.761
(0.038) (0.054) (0.069)
2.561 2.961 3.361
(0.101) (0.117) (0.132)
4.000
(0.158)
(Note: Engineering designator is 30SPA0536)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 8.68 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1A)
Bond Pad #3 (Vd1A)
Bond Pad #4 (Vg2A)
Bond Pad #5 (Vd2A)
Bond Pad #6 (Vg3A)
Bond Pad #7 (Vd3A)
Bond Pad #8 (RF Out)
Bond Pad #9 (Vd3B)
Bond Pad #10 (Vg3B)
Bond Pad #11 Vd2B)
Bond Pad #12 (Vg2B)
Bond Pad #13 (Vd1B)
Bond Pad #14 (Vg1B)
Bias Arrangement
Vg1
Vg2
Vg3
2
3
4
5
6
7
Bypass Capacitors - See App Note [2]
RF In 1
XP1027-BD
8 RF Out
14
13
12
Vd1
11
10
9
Vd2
Vd3
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 3 of 5
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
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