XP1017 Datasheet, PDF (3/6 Pages) Mimix Broadband – 30.0-36.0 GHz GaAs MMIC Power Amplifier

30.0-36.0 GHz GaAs MMIC
Power Amplifier
September 2005 - Rev 01-Sep-05
Mechanical Drawing
1.141 1.541 1.941 2.341 2.741 2.941
(0.045) (0.061) (0.076) (0.092) (0.108) (0.116)
2.500
(0.098)
2
3
4
5
67
P1017
1.710
1
(0.067)
8
1.851
(0.073)
0.0
14
13
12
11
10 9
0.0
1.141 1.541 1.941 2.341 2.741 2.941 3.300
(0.045) (0.061) (0.076) (0.092) (0.108) (0.116) (0.130)
(Note: Engineering designator is 32H2BA0070)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 5.115 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd2)
Bias Arrangement
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd2)
Bond Pad #6 (VDIF1)
Bond Pad #7 (VIN2)
Bond Pad #8 (RF Out)
Bond Pad #9 (VIN1)
Bond Pad #10 (VDIF2)
Bond Pad #11 (Vd4)
Bond Pad #12 (Vg4)
Bond Pad #13 (Vd3)
Bond Pad #14 (Vg3)
Vd1,2
Vg1,2
2
3
4
5
67
VDIF2
VIN2
Bypass Capacitors - See App Note [3]
RF In 1
8 RF Out
14
13
12
11
10 9
Vg3,4
Vd3,4
VIN1
VDIF1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 3 of 6
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
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