CMM3020-BD Datasheet, PDF (3/3 Pages) Mimix Broadband – 30 kHz to 20 GHz GaAs MMIC Optical Modulator Driver Amplifer

CMM3020-BD
Advanced Product Information - January 2000
(2 of 2)
Absolute Maximum Ratings
Parameter
Drain Voltage
Gate Voltage
Drain Current
Continuous Power Dissipation
Channel Temperature
Storage Temperature
Mounting Temperature
Input Power
Rating
12 V
-5 V
350 mA
3.0 W
+175°C
-65°C to +175°C
+320°C
+23 dBm
Die Attach and Bonding Procedures
Die Attach: Eutectic die attach is recommended. For eutec-
tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1
min or less.
Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding:
Stage Temperature: 250°C; Bond Tip Temperature: 150°C;
Bonding Tip Pressure: 18 to 40 gms depending on size of
wire.
Schematic Diagram
Ordering Information
Part Number for Ordering
CMM3020-BD-0048
CMM3020-BD-0192
System Application/Description
OC-48/STM-16
OC-192/STM-64
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