30DBL0537 Datasheet, PDF (3/5 Pages) Mimix Broadband – 14.5-17.0/29.0-34.0 GHz GaAs MMIC Active Doubler

14.5-17.0/29.0-34.0 GHz GaAs MMIC
Active Doubler
May 2005 - Rev 20-May-05
Mechanical Drawing
0.943
(0.037)
1.343 1.544
(0.053) (0.061)
30DBL0537
1.000
(0.039)
2
34
0.420
1
(0.017)
0.0
n₅
0.611
(0.024)
tio
c
0.0
u
2.000
(0.079)
d ^{(Note: Engineering designator is 30DBL0537)}
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
o _{Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.240 mg.}
r _{Bond Pad #1 (RF In)}
Bond Pad #3 (Vd2)
Bond Pad #5 (RF Out)
Bond Pad #2 (Vd1)
-p ^{Bias Arrangement}
Vd1,2,3
Bond Pad #4 (Vd3)
Bypass Capacitors - See App Note [2]
Vd1,2,3
re₂
34
P_{RF In 1}
5 RF Out
RF In
RF Out
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 3 of 5
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
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