XR1000 Datasheet, PDF (2/6 Pages) Mimix Broadband – 17.0-27.0 GHz GaAs MMIC Receiver

17.0-27.0 GHz GaAs MMIC
Receiver
May 2005 - Rev 13-May-05
Mechanical Drawing
1.331
(0.052)
3.500
(0.138)
3
3.183
2
(0.125)
4
3.183
(0.125)
R1000
0.874
1
(0.034)
6
5
0.0
0.0
1.030 1.630
2.660
(0.041) (0.064)
(0.105)
(Note: Engineering designator is 25KRP_01E1)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 5.777 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (IF1)
Bond Pad #3 (LO)
Bond Pad #4 (IF2)
Bond Pad #5 (Vd)
Bond Pad #6 (Vg)
Bias Arrangement
LO
3
IF1 ₂
4
IF2
Bypass Capacitors - See App Note [2]
IF1
LO
IF2
1
RF In
Vd
Vg
6
5
Vg
Vd
RF
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 2 of 6
Characteristic Data and Specifications are subject to change without notice. 2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purcha^©sing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.