CMM0016-BD Datasheet, PDF (2/5 Pages) Mimix Broadband – 2.0 to 20.0 GHz GaAs MMIC 1W Power Amplifer

CMM0016-BD
2.0 to 20.0 GHz
GaAs MMIC
1W Power Amplifier
Chip Diagram
Advanced Product Information
August 2004
(1 of 4)
Features
❏ Small Size: 2.32 x 1.30 x 0.076 mm
❏ Integrated On-Chip DC Blocking
❏ Single Bias Operation
❏ Directly Cascadable – Fully Matched
❏ Unconditionally Stable
❏ P1dB: 29 dBm, Typ. @ 18 GHz
❏ Linear Gain: 9.5 dB, Typ. @ 18 GHz
❏ pHEMT Technology
❏ Silicon Nitride Passivation
Units: mm
Specifications (TA = 25°C, Vdd = 12V) ¹
Parameters
Frequency Range
Linear Gain
Gain Flatness
Power Output: 2-18 GHz (@1 dB Gain Compression)
Power Output: 2-20 GHz (@1 dB Gain Compression)
P1dB Variation (over operating frequency)
Saturated Output Power: 2-18 GHz
Saturated Output Power: 2-20 GHz
Input Return Loss
Output Return Loss
Current
Thermal Resistance
Stability ²
Units
Min
Typ
GHz
2.0
dB
8.5
±dB
dBm
28.5
dBm
26.5
dBm
dBm
29.5
dBm
27.5
dB
dB
mA
650
690
°C/W
Unconditionally Stable
Notes: 1. Tested on Celeritek Connectorized evaluation board (standard assembly condition detailed on page 4).
2. Stability factor measured on-wafer.
Max
20.0
12.5
1.5
5.0
-10.0
-10.0
730
15.7
Absolute Maximum Ratings ¹
Parameter
Rating
Drain Voltage
9.0V (min.) / 13.0V (max.)
Drain Current
750 mA
Continuous Power Dissipation
9.5 W
Input Power
20 dBm
Storage Temperature
-50°C to +150°C
Channel Temperature
175°C
Operating Backside Temperature -40°C to (See note 2)
Notes: 1. Operation outside these limits can cause permanent damage.
2. Calculation maximum operating temperature:
Tmax = 175–(Pdis [W] x 15.7) [°C].
Die Attach and Bonding Procedures
Die Attach: Eutectic die attach is recommended. For eutec-
tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1
min or less.
Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding:
Stage Temperature: 250°C; Bond Tip Temperature: 150°C;
Bonding Tip Pressure: 18 to 40 gms depending on size of
wire.
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Santa Clara, California 95054
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