CMM-5-BD Datasheet, PDF (2/5 Pages) Mimix Broadband – 2.0-6.0 GHz GaAs MMIC Amplifier

2.0-6.0 GHz
GaAs MMIC Amplifier
January 2007 - Rev 15-Jan-07
Specifications (T_A = 25ºC,V_DD = 6V, 2-6 GHz)
CMM-5-BD
Die Attach and Bonding Procedures
Die Attach: Conductive epoxy or preform die attach is recom-
mended. For preform die attach: Preform: AuSn (80% Au, 20%
Sn); Stage Temperature: 290 ºC, +/-5 ºC; Handling Tool: Tweezers;
Time: 1 min or less.
Bonding Diagram
Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding: Stage
Temperature: 250 ºC ; Bond Tip Temperature: 150 ºC; Bonding
Tip Pressure: 18 to 40 gms depending on size of wire.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: [phone] Fax: [phone] mimixbroadband.com
Page 2 of 5
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
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