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CMM0016_06 Datasheet, PDF (1/5 Pages) Mimix Broadband – 2.0-20.0 GHz GaAs MMIC 1W Power Amplifier
2.0-20.0 GHz GaAs MMIC
1W Power Amplifier
October 2006 - Rev 13-Oct-06
Features
Small Size: 2.32x1.30x0.076mm
Integrated On-Chip DC Blocking
Single Bias Operation
Directly Cascadable - Fully Matched
Unconditionally Stable
P1dB: 29 dBm, Typ. @ 18 GHz
Linear Gain: 9.5 dB, Typ. @ 18 GHz
pHEMT Technology
Silicon Nitride Passivation
Chip Diagram
Units: mm
CMM0016
1
Specifications (TA= 25°C,Vdd = 12V)
Parameters
Units
Min
Typ
Frequency Range
GHz
2.0
Linear Gain
dB
8.5
Gain Flatness
±dB
Power Output: 2-18 GHz (@1 dB Gain Compression)
dBm
28.5
Power Output: 2-20 GHz (@1 dB Gain Compression)
dBm
26.5
P1dB Variation (over operating frequency)
dBm
Saturated Output Power: 2-18 GHz
Saturated Output Power: 2-20 GHz
dBm
29.5
dBm
27.5
Input Return Loss
dB
Output Return Loss
dB
Current
mA
650
690
Thermal Resistance
Stability 2
°C/W
Unconditionally Stable
Notes: 1. Tested on Celeritek Connectorized evaluation board (standard assembly condition detailed on page 4).
2. Stability factor measured on-wafer.
Max
20.0
12.5
1.5
5.0
-10.0
-10.0
730
15.7
1
Absolute Maximum Ratings
Parameter
Rating
Drain Voltage
9.0V (min.) / 13.0V (max.)
Drain Current
750 mA
Continuous Power Dissipation
9.5 W
Input Power
20 dBm
Storage Temperature
-50°C to +150°C
Channel Temperature
175°C
Operating Backside Temperature -40°C to (See note 2)
Notes: 1. Operation outside these limits can cause permanent damage.
2. Calculation maximum operating temperature:
Tmax = 175–(Pdis [W] x 15.7) [°C].
Die Attach and Bonding Procedures
Die Attach: Eutectic die attach is recommended. For eutec-
tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1
min or less.
Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding:
Stage Temperature: 250°C; Bond Tip Temperature: 150°C;
Bonding Tip Pressure: 18 to 40 gms depending on size of
wire.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 5
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
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