896 Datasheet, PDF (1/1 Pages) Mill-Max Mfg. Corp. – MISCELLANEOUS CONNECTORS Mini Universal Serial Bus Surface Mount Sockets

MISCELLANEOUS CONNECTORS
Mini Universal Serial Bus
Surface Mount Sockets
Series 896, 897
9.2
2.5
PCB EDGE
1.5 (X4)
5.5
2.95
PIN 1
PIN 5
2.3 TYP.
PIN 1
1.0
5.25
2.50
9.0
6.90
0.80 TYP.
PIN 5
RoHS
2002/95/EC
5.9
9.2
4.4
Fig. 1
2.5
PCB EDGE
Features
• Mini USB receptacles for surface mount.
• 5 Pin (one ID Pin), 0.8mm pitch, mini USB connector.
• Reduced mounting space.
• Fully Shielded.
• Fully compliant with current USB 2.0 specifications.
• Smaller and lighter than existing USB connectors for
portable and handheld devices.
• Packaged on Tape & Reel - 700 parts per reel.
1.5 (X4)
5.5
2.95
PIN 1
PIN 5
PIN 1
2.3 TYP.
1.0
5.25
2.50
9.0
6.90
0.80 TYP.
PIN 5
Ordering Information:
Figure 1: Mini Type A Recep., Single,Surface Mount
896-43-005-00-100001
Figure 2: Mini Type B Recep., Single,Surface Mount
897-43-005-00-100001
Specifications
5.9
4.4
Fig. 2
Applications:
• Cell phones
• Digital still cameras
• Digital video cameras
• PDAs
• MP3 Players
• Other portable and hand-held devices
Materials:
Terminals: Copper Alloy, Tin Plated
Contacts: Copper Alloy, 0,76μm Gold Plated
Casing & Shield: Stainless Steel
Insulator material: High temp. thermoplastic rated UL94V-0
Ratings:
Voltage: 30VAC (rms)
Current: 1A max. per contact for 30°C temperature rise
All housing materials rated for “lead-free” soldering up to 260ºC
Electrical:
Contact resistance: 50mΩ max.
Insulation resistance: 100MΩ min.
Dielectric withstanding voltage: 100VAC at sea level
Capacitance: 2pF max.
Mechanical:
Random vibration: No discontinuity >1μs per EIA 364-28, cond. V, letter A
Physical shock: No discontinuity >1μs per EIA 364-27, condition H
Durability: 5000 cycles min. per EIA 364-09
Mating force: 35 Newtons max. per EIA 364-13
Unmating force: Initial - 7 Newtons min. per EIA 364-13
After test - 3 Newtons min. per EIA 364-13
Cable Pull-out force per EIA 364-38
Environmental:
Thermal shock per EIA 364-32, condition I
Humidity per EIA 364-31, method III, condition A
Temperature life per EIA 364-17, condition 3, method A
Solderability per EIA 364-52, category 2
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