HMC607 Datasheet, PDF (7/9 Pages) Hittite Microwave Corporation – GaAs MMIC HIGH ISOLATION SPDT SWITCH, DC - 15 GHz

v04.0809
Outline Drawing
HMC607
GaAs MMIC HIGH ISOLATION
SPDT SWITCH, DC - 15 GHz
4
Die Packaging Information ^[1]
Standard
Alternate
WP-17 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. BOND PAD METALIZATION: GOLD
7. NO CONNECTION REQUIRED FOR UNLABLED BOND PADS.
8. OVERALL DIE SIZE ±.002”
Pad Descriptions
Pad Number
Function
1, 4, 7
RF1, RFC, RF2
Description
This pin is DC coupled and matched to 50 Ohm. Blocking
capacitors are required if RF line potential is not equal to 0V.
Interface Schematic
2, 10
B
3, 11
B
5, 8
A
6, 9
A
See truth table and control voltage table.
Alternate A & B control pads provided.
Die Bottom
GND
Die bottom must be connected to RF ground.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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