HMC465 Datasheet, PDF (7/11 Pages) Hittite Microwave Corporation – GaAs PHEMT MMIC MODULATOR DRIVER AMPLIFIER, DC - 20.0 GHz

v09.0114
Absolute Maximum Ratings
Drain Bias Voltage (Vdd)
Gate Bias Voltage (Vgg1)
Gate Bias Current (Igg1)
Gate Bias Voltage (Vgg2)
Gate Bias Current (Igg2)
RF Input Power (RFIN)(Vdd = +8V)
Channel Temperature
Continuous Pdiss (T = 85 °C)
(derate 24 mW/°C above 85 °C)
Thermal Resistance
(channel to die bottom)
Storage Temperature
Operating Temperature
+9V
-2 to 0V
+3.2mA
(Vdd -8) V to +3 Vdc
+3.2mA
+23 dBm
175 °C
2.17 W
41.5 °C/W
-65 to +150 °C
-55 to +85 °C
Outline Drawing
HMC465
GaAs pHEMT MMIC MODULATOR
DRIVER AMPLIFIER, DC - 20 GHz
Typical Supply Current vs. Vdd
Vdd (V)
+7.5
+8.0
+8.5
Idd (mA)
161
160
159
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information ^[1]
Standard
Alternate
GP-1 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS IN INCHES [MILLIMETERS]
2. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS
3. DIE THICKNESS IS 0.004 (0.100)
4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE
5. BACKSIDE METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. BOND PAD METALIZATION: GOLD
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: [phone] Fax: [phone] Order On-line at www.hittite.com
4
Application Support: Phone: [phone] or [e-mail]