HMC424 Datasheet, PDF (7/9 Pages) Hittite Microwave Corporation – 0.5dB LSB GaAs MMIC 6-BIT DIGITAL ATTENUATOR, DC - 13 GHz

Outline Drawing
v06.0809
HMC424
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
1
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).
2. TYPICAL BOND PAD IS .004” SQUARE.
3. TYPICAL BOND PAD SPACING IS .006”
CENTER TO CENTER EXCEPT AS NOTED.
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. BOND PAD METALIZATION: GOLD
Pad Descriptions
Pad Number
Function
GND
1, 3
RF1, RF2
2
VEE
Description
Die bottom must be connected to RF ground.
This pad is DC coupled and matched to 50 Ohm. Blocking
capacitors are required if RF line potential is not equal to 0V.
Supply Voltage -5V ± 10%
Interface Schematic
4, 5, 6, 7, 8, 9
V1 - V6
See truth table and control voltage table.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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