HMC136 Datasheet, PDF (7/9 Pages) Hittite Microwave Corporation – GaAs MMIC BI-PHASE MODULATOR, 4 - 8 GHz

v03.0909
Outline Drawing
HMC136
GaAs MMIC BI-PHASE
MODULATOR, 4 - 8 GHz
5
Die Packaging Information ^[1]
Standard
Alternate ^[2]
WP-2 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] Reference this suffix only when ordering alternate die
packaging.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BOND PAD SPACING IS .006” CENTER TO CENTER.
4. BACKSIDE METALIZATION: GOLD.
5. BACKSIDE METAL IS GROUND.
6. BOND PAD METALIZATION: GOLD.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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