HMC203 Datasheet, PDF (6/7 Pages) Hittite Microwave Corporation – GaAs MMIC DOUBLE-BALANCED MIXER, 14 - 23 GHz

v03.1007
Absolute Maximum Ratings
RF / IF Input
LO Drive
Storage Temperature
Operating Temperature
+13 dBm
+27 dBm
-65 to +150 °C
-55 to +85 °C
4
Outline Drawing
HMC203
GaAs MMIC DOUBLE-BALANCED
MIXER, 14 - 23 GHz
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information ^[1]
Standard
Alternate
WP-8 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. BOND PADS ARE .004” SQUARE.
4. BOND PAD SPACING CENTER TO CENTER IS .006”.
5. BACKSIDE METALLIZATION: GOLD.
6. BOND PAD METALLIZATION: GOLD.
7. BACKSIDE METAL IS GROUND.
8. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
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20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com