SSTDPAD5 Datasheet, PDF (1/1 Pages) Micross Components – Linear Systems replaces discontinued Siliconix SSTDPAD5

SSTDPAD5
LOW LEAKAGE
PICO-AMP DUAL DIODE
Linear Systems replaces discontinued Siliconix SSTDPAD5
The SSTDPAD5 is a low leakage Monolithic Dual Pico-Amp Diode
The SSTDPAD5 extremely low-leakage monolithic dual
diode provides a superior alternative to conventional
diode technology when reverse current (leakage) must
be minimized. In addition the monolithic dual
construction allows excellent capacitance matching per
diode. The SSTDPAD5 features a leakage current of -5
pA and is well suited for use in applications such as
input protection for operational amplifiers.
SSTDPAD5 Benefits:
ƒ Negligible Circuit Leakage Contribution
ƒ Circuit “Transparent” Except to Shunt
High-Frequency Spikes
ƒ Simplicity of Operation
SSTDPAD5 Applications:
ƒ Op Amp Input Protection
ƒ Multiplexer Overvoltage Protection
FEATURES
DIRECT REPLACEMENT FOR SILICONIX SSTDPAD5
HIGH ON ISOLATION
EXCELLENT CAPACITANCE MATCHING
ULTRALOW LEAKAGE
REVERSE BREAKDOWN VOLTAGE
REVERSE CAPACITANCE
ABSOLUTE MAXIMUM RATINGS
@ 25°C (unless otherwise noted)
Maximum Temperatures
Storage Temperature
Operating Junction Temperature
Maximum Power Dissipation
Continuous Power Dissipation
MAXIMUM CURRENT
Forward Current (Note 1)
20fA
∆C_R ≤ 0.5pF
≤ 5 pA
BV_R ≥ ‐30V
C_rss ≤ 4.0pF
‐65°C to +150°C
‐55°C to +135°C
500mW
50mA
Click To Buy ^{SSTDPAD5 ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)}
SYMBOL
CHARACTERISTICS
MIN. TYP.
MAX.
BV_R
Reverse Breakdown Voltage
‐45
‐‐
‐‐
UNITS
V
CONDITIONS
I_R = ‐1µA
V_F
Forward Voltage
‐‐
0.8
1.5
V
I_F = 1mA
C_rSS
Total Reverse Capacitance
‐‐
‐‐
2.0
pF
V_R = ‐5V, f = 1MHz
|C_R1‐C_R2|
Differential Capacitance (∆C_R)
‐‐
‐‐
0.5
pF
V_R1 = V_R2 = ‐5V, f = 1MHz
I_R
Maximum Reverse Leakage Current ‐‐
‐‐
‐100
pA
V_R = ‐ 20V
Notes:
1. Absolute maximum ratings are limiting values above which SSTDPAD5 serviceability may be impaired.
Available Packages:
SSTDPAD5 in SOIC
SSTDPAD5 available as bare die
Please contact Micross for full package and die dimensions
SOIC (Top View)
Micross Components Europe
Tel: [phone]
Email: [e-mail]
Web: http://www.micross.com/distribution.com
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.
Micross Components Ltd, United Kingdom, Tel: [phone], Fax: [phone], Email: [e-mail] Web: www.micross.com/distribution.aspx