SSTDPAD100_SOIC Datasheet, PDF (1/1 Pages) Micross Components – low leakage Monolithic Dual Pico-Amp Diode

SSTDPAD100
LOW LEAKAGE
PICO-AMP DUAL DIODE
Linear Systems replaces discontinued Siliconix SSTDPAD100
The SSTDPAD100 is a low leakage Monolithic Dual Pico-Amp Diode
The SSTDPAD100 low-leakage monolithic dual diode
provides a superior alternative to conventional diode
technology when reverse current (leakage) must be
minimized. In addition the monolithic dual construction
allows excellent capacitance matching per diode. The
SSTDPAD100 features a leakage current of -100 pA
and is well suited for use in applications such as input
protection for operational amplifiers.
SSTDPAD100 Benefits:
ƒ Negligible Circuit Leakage Contribution
ƒ Circuit “Transparent” Except to Shunt
High-Frequency Spikes
ƒ Simplicity of Operation
SSTDPAD100 Applications:
ƒ Op Amp Input Protection
ƒ Multiplexer Overvoltage Protection
FEATURES
DIRECT REPLACEMENT FOR SILICONIX SSTDPAD100
HIGH ON ISOLATION
EXCELLENT CAPACITANCE MATCHING
ULTRALOW LEAKAGE
REVERSE BREAKDOWN VOLTAGE
REVERSE CAPACITANCE
ABSOLUTE MAXIMUM RATINGS
@ 25°C (unless otherwise noted)
Maximum Temperatures
Storage Temperature
Operating Junction Temperature
Maximum Power Dissipation
Continuous Power Dissipation
MAXIMUM CURRENT
Forward Current (Note 1)
20fA
∆C_R ≤ 0.5pF
≤ 100 pA
BV_R ≥ ‐30V
C_rss ≤ 4.0pF
‐65°C to +150°C
‐55°C to +135°C
500mW
50mA
Click To Buy ^{SSTDPAD100 ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)}
SYMBOL
CHARACTERISTICS
MIN. TYP.
MAX.
BV_R
Reverse Breakdown Voltage
‐30
‐‐
‐‐
UNITS
V
CONDITIONS
I_R = ‐1µA
V_F
Forward Voltage
‐‐
0.8
1.5
V
I_F = 1mA
C_rSS
Total Reverse Capacitance
‐‐
‐‐
4.0
pF
V_R = ‐5V, f = 1MHz
|C_R1‐C_R2|
Differential Capacitance (∆C_R)
‐‐
‐‐
0.5
pF
V_R1 = V_R2 = ‐5V, f = 1MHz
I_R
Maximum Reverse Leakage Current ‐‐
‐‐
‐100
pA
V_R = ‐ 20V
Notes:
1. Absolute maximum ratings are limiting values above which SSTDPAD100 serviceability may be impaired.
Available Packages:
SSTDPAD100 in SOIC
SSTDPAD100 available as bare die
Please contact Micross for full package and die dimensions
SOIC (Top View)
Micross Components Europe
Tel: [phone]
Email: [e-mail]
Web: http://www.micross.com/distribution.com
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.
Micross Components Ltd, United Kingdom, Tel: [phone], Fax: [phone], Email: [e-mail] Web: www.micross.com/distribution.aspx