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LS832 Datasheet, PDF (1/1 Pages) Micross Components – Linear Systems Ultra Low Leakage Low Drift Monolithic Dual JFET
LS832
MONOLITHIC DUAL
N-CHANNEL JFET
Linear Systems Ultra Low Leakage Low Drift Monolithic Dual JFET
The LS832 is a high-performance monolithic dual
JFET featuring extremely low noise, tight offset voltage
and low drift over temperature specifications, and is
targeted for use in a wide range of precision
instrumentation applications. The LS832 features a 25-
mV offset and 20-µV/°C drift.
FEATURES
ULTRA LOW DRIFT
| V GS1‐2 / T| ≤20µV/°C
ULTRA LOW LEAKAGE
LOW NOISE
IG = 80fA TYP.
en = 70nV/√Hz TYP.
LOW CAPACITANCE
CISS = 3pF MAX.
ABSOLUTE MAXIMUM RATINGS @ 25°C (unless otherwise noted)
The 8 Pin P-DIP and 8 Pin SOIC provide ease of
manufacturing, and the symmetrical pinout prevents
improper orientation.
(See Packaging Information).
LS832 Applications:
ƒ Wideband Differential Amps
ƒ High-Speed,Temp-Compensated Single-
Ended Input Amps
ƒ High-Speed Comparators
ƒ Impedance Converters and vibrations
detectors.
ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)
SYMBOL
CHARACTERISTICS
MIN.
BVGSS
Breakdown Voltage
40
BVGGO
Gate‐To‐Gate Breakdown
40
Click TRANSCONDUCTANCE
YfSS
Full Conduction
70
YfS
Typical Operation
50
|YFS1‐2 / Y FS|
Mismatch
‐‐
DRAIN CURRENT
IDSS
Full Conduction
0.5
|IDSS1‐2 / IDSS| Mismatch at Full Conduction
‐‐
GATE VOLTAGE
VGS(off) or Vp
Pinchoff voltage
0.6
VGS(on)
Operating Range
‐‐
GATE CURRENT
‐IGmax.
Operating
‐‐
‐IGmax.
High Temperature
‐‐
‐IGSSmax.
At Full Conduction
‐‐
‐IGSSmax.
High Temperature
5
IGGO
Gate‐to‐Gate Leakage
‐‐
OUTPUT CONDUCTANCE
YOSS
Full Conduction
‐‐
YOS
Operating
‐‐
COMMON MODE REJECTION
CMR
‐20 log | V GS1‐2/ V DS|
‐‐
‐20 log | V GS1‐2/ V DS|
‐‐
NOISE
NF
Figure
‐‐
en
Voltage
‐‐
CAPACITANCE
CISS
Input
‐‐
CRSS
Reverse Transfer
‐‐
CDD
Drain‐to‐Drain
‐‐
Maximum Temperatures
Storage Temperature
‐65°C to +150°C
Operating Junction Temperature
+150°C
Maximum Voltage and Current for Each Transistor – Note 1
‐VGSS
Gate Voltage to Drain or Source
‐VDSO
Drain to Source Voltage
‐IG(f)
Gate Forward Current
‐IG
Gate Reverse Current
Maximum Power Dissipation
40V
40V
10mA
10µA
Device Dissipation @ Free Air – Total
400mW @ +125°C
MATCHING CHARACTERISTICS @ 25°C UNLESS OTHERWISE NOTED
SYMBOL
CHARACTERISTICS VALUE UNITS CONDITIONS
| V GS1‐2 / T| max.
| V GS1‐2 | max.
DRIFT VS.
TEMPERATURE
OFFSET VOLTAGE
20 µV/°C VDG=10V, ID=30µA
TA=‐55°C to +125°C
25
mV VDG=10V, ID=30µA
TYP.
MAX.
UNITS
CONDITIONS
60
‐‐
V
VDS = 0
ID=1nA
‐‐
‐‐
V
I G= 1nA
ID= 0
IS= 0
To Buy 300
500
100
200
0.6
3
µmho
µmho
%
VDG= 10V
VDG= 10V
VGS= 0V f = 1kHz
ID= 30µA f = 1kHz
‐‐
10
mA
VDG= 10V
VGS= 0V
1
5
%
2
4.5
‐‐
4
‐‐
0.1
‐‐
0.1
‐‐
0.2
5
0.5
1
‐‐
‐‐
5
‐‐
0.5
90
‐‐
90
‐‐
‐‐
1
20
70
‐‐
3
‐‐
1.5
‐‐
0.1
V
V
pA
nA
pA
nA
pA
µmho
µmho
dB
dB
nV/√Hz
pF
pF
pF
VDS= 10V
VDS=10V
ID= 1nA
ID=30µA
VDG= 10V ID= 30µA
TA= +125°C
VDS =0
VGS= 0V, VGS= ‐20V, TA= +125°C
VGG = 20V
VDG= 10V
VDG= 10V
VGS= 0V
ID= 30µA
∆VDS = 10 to 20V ID=30µA
∆VDS = 5 to 10V ID=30µA
VDS= 10V VGS= 0V RG= 10MΩ
f= 100Hz NBW= 6Hz
VDS=10V ID=30µA f=10Hz NBW=1Hz
VDS= 10V, VGS= 0V, f= 1MHz
VDS= 10V, VGS= 0V, f= 1MHz
VDS= 10V, ID=30µA
Note 1 – These ratings are limiting values above which the serviceability of any semiconductor may be impaired
PDIP & SOIC (Top View)
Available Packages:
LS832 / LS832 in PDIP & SOIC
LS832 / LS832 available as bare die
Please contact Micross for full package and die dimensions
Tel: +44 1603 788967
Email: chipcomponents@micross.com
Web: http://www.micross.com/distribution
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.