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ASJE1200R063 Datasheet, PDF (1/7 Pages) Micross Components – Positive Temperature Coeffi cient for Ease of Paralleling | |||
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ADVANCE INFORMATION SiC JFET
ASJE1200R063
Normally-OFF Trench Silicon
Carbide Power JFET
FEATURES:
Die Inside
⢠Hermetic TO-258 Packaging
⢠200°C Maximum Operating Temperature (for 260oC Contact Factory)
⢠Available Screening:
- MIL-PRF-19500 Equivalent
- Space Level
- MIL-STD-750 Methods & Conditions
⢠Inherent Radiation Tolerance >100K TID
⢠Positive Temperature Coefï¬cient for Ease of Paralleling
⢠Compatible with Standard Gate Driver ICs
⢠Temperature Independent Switching Behavior
⢠Extremely Fast Switching
4
⢠1200 Volt Drain-Source Blocking Voltage
⢠RDS(on)max of 0.063 ï
⢠Voltage Controlled
⢠Low Gate Charge
⢠Low Intrinsic Capacitance
ProductSummary
BVDS
1200
V
RDS(ON)max 0.063
:
ETS,typ
440
μJ
D (2,4)
G (1)
APPLICATIONS:
TO-258
⢠Satellite Solar Inverters
⢠Mil Spec Power Supplies
- Switch Mode
- Uninterrupted
⢠Jet Engine Electronics
⢠Down-hole Electronics (Motor / Compressor Control)
123
S (3)
Internal Schematic
Non-isolated tab version shown.
For isolated tab version, tab (4)
is No Connect.
MAXIMUM RATINGS
Parameter
Symbol
Conditions
Value
Unit
ContinuousDrainCurrent
PulsedDrainCurrent(1)
ID,Tj=125
ID,Tj=175
IDM
Tj=125°C
Tj=175°C
Tc=25°C
30
A
20
60
A
ShortCircuitWithstandTime
PowerDissipation
tSC
VDD<800V,TC<125°C
50
μS
PD
Tc=25°C
250
W
GateͲSourceVoltage
OperatingandStorageTemperature
LeadTemperatureforSoldering
(1)Limitedbypulsewidth
Static
Ͳ15to+3
V
VGS
AC(2)
Ͳ15to+15
V
Tj,Tj,stg
Ͳ55to+200* oC
Tsold
1/8"fromcase<10s
260
oC
(2)RgEXT=0.5ohm,tp<200ns
*Contactfactoryfor260oC
THERMAL CHARACTERISTICS
Parameter
ThermalResistance,junctionͲtoͲcase
ThermalResistance,junctionͲtoͲambient
Symbol
Rth,JC
Rth,JA
Value
Typ
Max
Ͳ
TBD
Ͳ
TBD
Unit
°C/W
For more products and
information, please visit our
website at www.micross.com
ASJE1200R063
Rev. 0.1 06/11
Micross Components reserves the right to change products or speciï¬cations without notice.
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