AS8FLC2M32 Datasheet, PDF (1/29 Pages) Austin Semiconductor – Hermetic, Multi-Chip Module (MCM) 64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array

FLASH
AS8FLC2M32
Hermetic, Multi-Chip Module
(MCM)
64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array
FIGURE 1: PIN ASSIGNMENT
(Top View)
Available via Applicable Specifications:
• MIL-PRF-38534, Class H
• DSCC SMD 5962-08245
FEATURES
• 64Mb device, total density, organized as 2M x 32
• Bottom Boot Block (Sector) Architecture
(Contact factory for top boot)
• Operation with single 3.0V Supply
• Available in multiple Access time variations
• Individual byte control via individual byte selects (CSx\)
• Low Power CMOS
• 1,000,000 Erase/Program Cycles
• Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
• Sector Architecture:
• One 16K byte, two 8K byte, one 32K byte and
thirty-one 64Kbyte sectors (byte mode)
• Any combination of sectors can be concurrently erased
• MCM supports full array (multi-chip) Erase
• Embedded Erase and Program Algorithms
• Erase Suspend/Resume; Supports reading data from or
programming data to a sector not being Erased
• TTL Compatible Inputs and Outputs
• Military and Industrial operating temperature ranges
OPTION
Access Speed
70ns*
90ns
100ns
120ns
*Contact Factory
Package
Ceramic Quad Flat Pack
Ceramic Hex Inline Pack
MARKING
-70
-90
-100
-120
Q
P
Temperature Range
Full Mil (MIL-PRF-38534, Class H /Q
Military Temp (-55^oC to +125^oC) /XT
Industrial (-40^oC to +85^oC)
/IT
For more products and information
please visit our web site at
www.micross.com
ID/OQ00
10
60
ID/OQ11
11
59
ID/0Q22
12
78
ID/OQ33
13
57
ID/OQ44
14
76
I_D/O_Q5₅
15
55
ID/OQ6
16
54
ID/OQ77
17
53
GND
18
52
ID/OQ88
19
51
ID/OQ99
20
50
DI/QO1100
21
49
D_I/Q_O1₁1₁
22
[Package Designator QT]
48
DI/0Q1122
23
47
D_I/Q_O1₁3₃
24
46
D_I/OQ1₁4₄
25
45
D_I/OQ1₁5₅
26
44
DI/QO1166
DI/QO1177
DI/QO1188
DI/OQ19
DI/QO2200
D^I/Q^O2²1¹
DI/QO2222
DI/QO2233
GND
DI/QO2244
DI/OQ25
DI/QO2266
DI/QO2277
DI/QO2288
DI/OQ29
DI/QO3300
DI/OQ31
Pin Assignment
(Top View)
ID/OQ88 Reset\ ID/OQ15
ID/OQ24 VCC ID/OQ331
ID/OQ99 CS2\ DI/QO144
ID/OQ225 CS4\ DI/OQ30
DI/OQ100 GND DI/QO133
DI/OQ266
NC ID/OQ29
A14 DI/OQ111 DI/OQ122
A7 ID/OQ27 ID/OQ28
A16 A10 OE\
A12
A4
A1
A11 A9
A17 _{66 HIP} AN2C0
A5
A2
A0
A15 WE\
A13
A6
A3
A18 VCC ID/OQ77
A8
NC ID/OQ223
ID/OQ0 CS1\ DI/OQ6
ID/OQ16 CS3\ DI/OQ22
DI/QO11 A19 DI/OQ5
DI/OQ177 GND ID/OQ21
ID/OQ2 DI/QO33 DI/OQ4
DI/QO188 DI/OQ19 DI/OQ200
[Package Designator PH]
GENERAL DESCRIPTION
The AS8FLC2M32B is a 64Mb FLASH Multi-Chip Module
organized as 2M x 32 bits. The module achieves high speed
access, low power consumption and high reliability by employ-
ing advanced CMOS memory technology. The military grade
product is manufactured in compliance to the MIL-PRF-38534
specifications, making the AS8FLC2M32B ideally suited for
military or space applications. The module is offered in a
68-lead 0.990 inch square ceramic quad flat pack or 66-lead
1.185inch square ceramic Hex In-line Package (HIP). The
CQFP package design is targeted for those applications, which
require low profile SMT Packaging.
AS8FLC2M32B
Rev. 1.6 05/11
Micross Components reserves the right to change products or specifications without notice.
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