AS29F040 Datasheet, PDF (1/27 Pages) Alliance Semiconductor Corporation – 5V 512K x 8 CMOS FLASH EEPROM

512K x 8 FLASH
UNIFORM SECTOR 5.0V FLASH
MEMORY
AVAILABLE AS MILITARY
SPECIFICATIONS
• MIL-STD-883
• SMD 5962-96692
FEATURES
• Single 5.0V ±10% power supply operation
• Fastest access times: 55, 60, 70, 90, 120, & 150ns
• Low power consumption:
3 20 mA typical active read current
3 30 mA typical program/erase current
3 1 μA typical standby current (standard access time to
active mode)
• Flexible sector architecture
3 Eight uniform 64 Kbyte each
3 Any combination of sectors can be erased
3 Supports full chip erase
• Sector protection
• Embedded Algorithms Erase & Program Algorithms
• Erase Suspend/Resume
• Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
• Compatible with JEDEC standards
3 Pinout and software compatible with single-power-
supply FLASH
• Data\ Polling and Toggle Bits
• 20-year data retention at 125°C
FLASH
AS29F040
PIN ASSIGNMENT
(Top View)
32-PIN Ceramic DIP (CW)
32-pin Flatpack (F)
32-pin Lead Formed Flatpack (DCG)
A18 1
A16 2
A15 3
A12 4
A7 5
A6 6
A5 7
A4 8
A3 9
A2 10
A1 11
A0 12
DQ0 13
DQ1 14
DQ2 15
VSS 16
32 VCC
31 WE\
30 A17
29 A14
28 A13
27 A8
26 A9
25 A11
24 OE\
23 A10
22 CE\
21 DQ7
20 DQ6
19 DQ5
18 DQ4
17 _DQ3
32-PAD Ceramic LCC (ECA)
4 3 2 32 31 30
A7 5
1
29
A6 6
28
A5 7
27
A4 8
26
A3 9
25
A2 10
24
A1 11
23
A0 12
22
I/O0 13
21
14 15 16 17 18 19 20
A14
A13
A8
A9
A11
OE\
A10
CE\
I/O 7
OPTIONS
• Timing
55ns
60ns
70ns
90ns
120ns
150ns
MARKING
-55
-60
-70
-90
-120
-150
For more products and information
please visit our web site at
www.micross.com
AS29F040
Rev. 2.3 01/10
OPTIONS
• Package Type
Ceramic DIP (600 mil)
Flatpack
Lead Formed Flatpack
Leadless Chip Carrier
MARKING
CW
F
DCG
ECA
• Temperature Ranges
Industrial Temperature (-40°C to +85°C)
Military Temperature (-55°C to +125°C)
883C Processing (-55°C to +125°C)
QML Processing (-55°C to +125°C)
IT
XT**
883C
Q
Micross Components reserves the right to change products or specifications without notice.
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