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2N5564 Datasheet, PDF (1/1 Pages) Vishay Siliconix – Matched N-Channel JFET Pairs
2N5564
MONOLITHIC DUAL
N-CHANNEL JFET
Linear Systems replaces discontinued Siliconix & National 2N5564
The 2N5564 are monolithic dual JFETS. The monolithic
dual chip design reduces parasitics and gives better
performance at very high frequencies while ensuring
extremely tight matching. These devices are an
excellent choice for use as wideband differential
amplifiers in demanding test and measurement
applications. The 2N5564 is a direct replacement for
discontinued Siliconix and National 2N5564.
The hermetically sealed TO-71 is well suited for military
and harsh environment applications.
(See Packaging Information).
2N5564 Applications:
ƒ Wideband Differential Amps
ƒ High-Speed,Temp-Compensated Single-
Ended Input Amps
ƒ High-Speed Comparators
ƒ Impedance Converters and vibrations
detectors.
FEATURES
Improved Direct Replacement for SILICONIX & NATIONAL 2N5564
HIGH GAIN
7500µmho MINIMUM
LOW “ON” RESISTANCE
ABSOLUTE MAXIMUM RATINGS 1
100Ω MAXIMUM
@ 25°C (unless otherwise noted)
Maximum Temperatures
Storage Temperature
Operating Junction Temperature
Maximum Power Dissipation
Device Dissipation (Each transistor)
Continuous Power Dissipation (Total)
Maximum Currents
Gate Current
Maximum Voltages
Gate to Drain
Gate to Source
Gate to Gate
‐65°C to +200°C
‐55°C to +125°C
325mW
650mW
50mA
‐40V
‐40V
±80V
MATCHING CHARACTERISTICS @ 25°C (unless otherwise stated)
SYMBOL
CHARACTERISTIC
|VGS1 – VGS2 |
Differential Gate to Source Cutoff Voltage
∆|VGS1 – VGS2 | / ∆T Differential Gate to Source Cutoff
IDSS1 / IDSS2
|IG1 – IG2 |
Click Voltage Change with Temperature
Gate to Source Saturation Current Ratio
Differential Gate Current
gfs1 / gfs2
Forward Transconductance Ratio2
MIN TYP MAX UNITS CONDITIONS
‐‐
‐‐
5
mV VDG = 15V, ID = 2mA
‐‐
‐‐
10
µV/°C VDG = 15V, ID = 2mA
To Buy 0.95
‐‐
1
TA = ‐55°C to +125°C
%
VDS = 10V, VGS = 0V
‐‐
‐‐
20
nA
VDG = 10V, ID = 5mA
TA = +125°C
0.95
‐‐
1
%
VDS = 15V, ID = 2mA, f = 1kHz
ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)
SYMBOL
CHARACTERISTICS
MIN.
TYP.
MAX. UNITS
CONDITIONS
BVGSS
Gate to Source Breakdown Voltage
‐40
‐‐
VGS(off)
Gate to Source Cutoff Voltage
‐0.5
‐‐
‐3
V
IG = ‐1µA, VDS = 0V
VDS = 15V, ID = 1nA
VGS(F)
Gate to Source Forward Voltage
‐‐
IDSS
Gate to Source Saturation Current3
5
IGSS
Gate Leakage Current3
‐‐
‐‐
1
‐‐
30
mA
‐‐
‐200
nA
IG = 2mA, VDS = 0V
VDS = 15V, VGS = 0V
VGS = ‐20V, VDS = 0V, 150°C
gfs
Forward Transconductance
7500
‐‐
12500
VDG = 15V, ID= 2mA, f = 1kHz
7000
‐‐
‐‐
µS
VDG = 15V, ID= 2mA, f = 100MHz
gos
Output Conductance
‐‐
‐‐
45
VDG = 15V, ID= 2mA, f = 1kHz
CISS
Input Capacitance
‐‐
‐‐
5
pF
VDG = 15V, ID= 2mA, f = 100MHz
CRSS
Reverse Transfer Capacitance
‐‐
‐‐
12
NF
Noise Figure
‐‐
‐‐
1
dB
VDG = 15V, ID = 2mA, f = 10Hz, RG = 1MΩ
_
Equivalent Input Noise Voltage
‐‐
‐‐
50
nV/√Hz
VDG = 15V, ID = 2mA, f = 10Hz
en
Notes: 1. Absolute Maximum ratings are limiting values above which serviceability may be impaired 2. Pulse Test: PW ≤ 300µs Duty Cycle ≤ 3%
3. Assumes smaller value in numerator
TO-71 (Top View)
Available Packages:
Please contact Micross for full package and die dimensions:
2N5564 in TO-71
2N5564 available as bare die
Email: chipcomponents@micross.com
Web: www.micross.com/distribution.aspx
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