English
Language : 

SG1825C_1 Datasheet, PDF (6/7 Pages) Microsemi Corporation – HIGH-SPEED CURRENT-MODE PWM
PRODUCT DATABOOK 1996/1997
SG1825C/SG2825C/SG3825C
HIGH-SPEED CURRENT-MODE PWM
NOT RECOMMENDED FOR NEW DESIGNS
APPLICATION INFORMATION
HIGH-SPEED LAYOUT AND BYPASSING
The SG1825C, like all high-speed circuits, requires extra attention to external
conductor and component layout to minimize undesired inductive and
capacitive effects. All lead lengths must be as short as possible. The best
printed circuit board choice would be a four-layer design, with the two
internal planes supplying power and ground. Signal interconnects should
be placed on the outside, giving a conductor-over-ground-plane
(microstrip) configuration. A two-sided printed circuit board with one side
dedicated as a ground plane is next best, and requires careful component
placement by a skilled pc designer.
Two supply bypass capacitors should be employed: a low-inductance
0.1µF ceramic within 0.25 inches of the +VIN pin for high frequencies, and
a 1 to 5µF solid tantalum within 0.5 inches of the VC pin to provide an energy
reservoir for the high-peak output currents. A low-inductance .01µF bypass
for the reference output is also recommended.
MICROPOWER STARTUP
Since the SG1825C typically draws 700µA of supply current before turning
on, a low power bleeder resistor from the rectified AC line supply is all that
is required for startup. A start capacitor, CS, is charged with the excess
current from the bleeder resistor. When the turn-on threshold voltage is
reached, the PWM circuit becomes active, energizing the power transistors.
The additional operating current required by the PWM is then provided by
a bootstrap winding on the main high-frequency power transformer.
SOFTSTART CIRCUIT / OUTPUT DUTY CYCLE LIMIT
The softstart pin of the SG1825C is held low when either the chip is in the
micropower mode, or when a voltage greater than +1.4 volts is present at
the ILIM/S.D. pin. The maximum positive swing of the voltage error amplifier
is clamped to the Softstart pin voltage, providing a ramp-up of peak charging
currents in the power semiconductors at turn-on.
In some cases, the duration of the Shutdown signal can be too short to
fully discharge the softstart capacitor. The illustrated resistor/discrete PNP
transistor configuration can be used to shorten the discharge time by a factor
of 50 or more. When the internal discharge transistor in the SG1825C turns
on, current will flow through surge limit resistor R1. As the resistor drop
approaches 0.6 volts, the external PNP turns on, providing a low resistance
discharge path for the energy in the softstart capacitor. The capacitor will
be rapidly discharged to +0.7 volts, which corresponds to zero duty cycle
in the pulse width modulator.
FREQUENCY SYNCHRONIZATION
Two or three SG1825C oscillators may be locked together with the
interconnection scheme shown, if the devices are within an inch or so of
each other. A master unit is programmed for desired frequency with RT and
CT as usual. The oscillators in the slave units are disabled by grounding CT
and by connecting RT to VREF. The logic in the slave units is locked to the
clock of the master with the wire-OR connection shown.
Many SG1825Cs can be locked to a master system clock by wiring the
oscillators as slave units, and distributing the master clock to each using a
tree-fanout geometry.
A P P L I C AT I O N F I G U R E S
FIGURE 1. — HIGH-SPEED LAYOUT and BYPASSING
VREF 16
SG1825C
VC 13
PWR GND 12
10
15
0.1µF
+VIN
GND
1µF
VREF
0.01µF
+VIN
FIGURE 2. — MICROPOWER STARTUP
TO POWER TRANSFORMER
L1
GND
L2
SG1825C
VC 13
POWER 12
GND
RB
GND 10
0.1µF 15 +VIN
1µF
CS + VIN
FIGURE 3. — SOFTSTART FAST RESET
+ VIN
SG1825C
CSS 8
VC 13
PWR GND 12
15 +VIN
0.1µF
GND 10
R1
100W
1µF
CSOFTSTART
FIGURE 4. — OSCILLATOR SYCHRONIZATION
MASTER
CLK 4
SG1825C
5
RT
CT 6
PWR GND 12
15 +VIN
0.1µF
GND 10
+ VIN
SLAVE
4 CLK
VREF 16
SG1825C
RT 5
CT 6
PWR GND 12
RT
CT
15 +VIN
0.1µF
GND 10
6
Copyright © 1994
Rev. 1.3a