LX7206 Datasheet, PDF (3/7 Pages) Microsemi Corporation – Integrated EMI Filter & ESD Protection for Earpiece Speaker & Microphone Ports

TM
Cu pad size
Pad Pitch
Pad Definition
Solder Mask Opening
Solder Stencil
Pad Protective Finish
LX7206
®
Integrated EMI Filter & ESD Protection for
Earpiece Speaker & Microphone Ports
PRODUCTION DATA SHEET
RECOMMENDED PCB PARAMETERS
Parameter
Value
0.275 +0.0/-0.025 mm
0.5mm
Non-Solder Mask Defined
0.325 ± 0.025 mm
0.25 x 0.25 mm square,
0.125 mm thick, laser cut, electro-polished
OSP (Organic Surface Preservative)
Non-Solder Mask Defined Cu
Pad (OSP finish)
0.275 mm dia.
Solder Mask Opening
0.325 mm dia.
Figure 1 – Recommended Non-Solder Mask Defined Pad
240 ^oC max
183 ^oC
150 ^oC
Preheat Zone
Flux Activation
Zone
Solder Reflow
Zone
Cooling Zone
~ 1min
~2 min
~ 1min
Time (s)
Figure 2 – Solder Reflow Profile. Maximum temperature is 240°C and maximum time above liquidous (183°C) is 60
seconds.
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]
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