ARF1505 Datasheet, PDF (3/4 Pages) Advanced Power Technology – N-CHANNEL ENHANCEMENT MODE POWER MOSFET

1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
-50 -25 0 25 50 75 100 125 150
Figure 4, Ty^Tp^Ci^,c^Ca^Al T^Sh^Ere^Ts^Eh^Mo^Pld^EV^Ro^Al^Tta^Ug^Re^Ev⁽s^°CTe⁾ mperature
ARF1505
35
V_GS = 10 & 9V
30
8V
25
7V
20
15
6V
10
5V
5
0
0
5
10 15 20 25 30
V_DFSi,_gD_uR_reA₅IN_{, T}-T_yO_pi-_cS_aO_l U_OR_uC_tpE_utV_CO_hL_aTA_raG_cE_te(_rV_isO_tiL_cT_sS)
0.12
0.10
D = 0.9
0.08
0.7
0.06
0.5
Note:
0.04
0.3
t1
t2
0.02
0.1
Duty Factor D = ^t1/t2
0.05
SINGLE PULSE
Peak T_J = P_DM x Z_θJC + TC
0
10^-5
10^-4
10^-3
10^-2
10 ^-1
1.0
RECTANGULAR PULSE DURATION (SECONDS)
Figure 6, Maximum Effective Transient Thermal Impedance, Junction-to-Case vs. Pulse Duration
TYPICAL LARGE SIGNAL
INPUT - OUPUT
IMPEDANCE
CHARACTERISTICS
F (MHz)
2.0
13.5
27
40
Zin (Ω)
5.4 - j 9.6
0.30 - j 1.2
0.26 + j .58
0.36 + j 1.6
Z_OL (Ω)
46 - j 10.5
16.4 - j 23
4.9 - j 14.6
2.3 - j 10.3
Zin - Gate shunted with 25Ω
Z_OL - Conjugate of optimum
load for 750 Watts output
I_DQ = 100mA
Vdd = 300V
Thermal Considerations and Package Mounting:
The rated 1500W power dissipation is only available
when the package mounting surface is at 25°C and the
junction temperature is 175°C. The thermal resis-
tance between junctions and case mounting surface
is 0.10°C/W. When installed, an additional thermal
impedance of 0.06°C/W between the package base and
the mounting surface is smooth and flat. Thermal joint
compound must be used to reduce the effects of small
surface irregularities. The heatsink should incorporate a
copper heat spreader to obtain best results.
The package is designed to be clamped to a heatsink. A
clamped joint maintains the required mounting pressure
while allowing for thermal expansion of both the device
and the heat sink. A simple clamp, and two 6-32 (M3.5)
screws can provide the minimum 125 lb. required
mounting force. T=4-6 in-lb. Please refer to App Note
1802 "Mounting Instructions for Flangeless Packages."
Clamp
Heat Sink
D
G
S
1.065
.250
S
D
S _.500
ARF15--
BeO 1525-xx
1.065
.045
S
G
S .500
.005
.207
.375
.207
.105 typ.
HAZARDOUS MATERIAL WARNING
The ceramic portion of the device between
leads and mounting surface is beryllium oxide,
BeO. Beryllium oxide dust is toxic when in-
haled. Care must be taken during handling
and mounting to avoid damage to this area .
These devices must never be thrown away
with general industrial or domestic waste.