ARF1501 Datasheet, PDF (3/4 Pages) Advanced Power Technology – RF POWER MOSFET N-CHANNEL ENHANCEMENT MODE

1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
-50 -25 0 25 50 75 100 125 150
Figure 4, Ty^Tp^Ci^,c^Ca^Al T^Sh^Ere^Ts^Eh^Mo^Pld^EV^Ro^Al^Tta^Ug^Re^Ev⁽s^°CTe⁾ mperature
0.14
ARF1501
45
10V
40
9V
35
30
8V
25
20
7V
15
6V
10
5
5V
00
5
10 15 20 25 30
V_DFSi,_gD_uR_reA₅IN_{, T}-T_yO_pi-_cS_aO_l U_OR_uC_tpE_utV_CO_hL_aTA_raG_cE_te(_rV_isO_tiL_cT_sS)
0.12
D = 0.9
0.10
0.7
0.08
0.06
0.04
0.02
0
10^-5
0.5
Note:
0.3
t1
0.1
0.05
SINGLE PULSE
t2
Duty Factor D = ^t1/t2
Peak T_J = P_DM x Z_θJC + TC
10^-4
10^-3
10^-2
10^-1
1.0
RECTANGULAR PULSE DURATION (SECONDS)
Figure 6, Maximum Effective Transient Thermal Impedance, Junction-to-Case vs. Pulse Duration
Table 1 - Typical Class AB Large Signal Impedance -- ARF1501
F (MHz)
2.0
13.5
27
40
Zin (Ω)
10.6 -j 12.2
0.5 -j 2.7
0.22 -j 0.8
0.2 +j .12
Z_OL (Ω)
31 -j 4.7
15.6 -j 16
6.2 -j 12.6
3.1 -j 9.4
Zin - Gate shunted with 25Ω I_DQ = 100mA
Z_OL - Conjugate of optimum load for 750 Watts
output at Vdd = 250V
Thermal Considerations and Package
Mounting:
The rated 1500W power dissipation is only avail-
able when the package mounting surface is at
25°C and the junction temperature is 200°C. The
thermal resistance between junctions and case
mounting surface is 0.12°C/W. When installed, an
additional thermal impedance of 0.1°C/W between
the package base and the mounting surface is typi-
cal. Insure that the mounting surface is smooth
and flat. Thermal joint compound must be used to
reduce the effects of small surface irregularities.
The heatsink should incorporate a copper heat
spreader to obtain best results.
The package is designed to be clamped to a
heatsink. A clamped joint maintains the required
mounting pressure while allowing for thermal ex-
pansion of both the device and the heat sink. A
simple clamp, and two 6-32 (M3.5) screws can pro-
vide the minimum 125lb required mounting force.
T = 12 in-lb.
Heat Sink
D
G
S
.250
S
D
S _.500
ARF15--
BeO 1525-xx
1.065
.045
S
G
S .500
.005
.207
.375
.207
.105 typ.
HAZARDOUS MATERIAL WARNING
The ceramic portion of the device between
leads and mounting surface is beryllium oxide,
BeO. Beryllium oxide dust is toxic when in-
haled. Care must be taken during handling
and mounting to avoid damage to this area
These devices must never be thrown away
with general industrial or domestic waste.