APTGT75TA60PG Datasheet, PDF (3/5 Pages) Microsemi Corporation – Triple phase leg Trench + Field Stop IGBT Power Module

APTGT75TA60PG
Thermal and package characteristics
Symbol Characteristic
R_thJC Junction to Case Thermal Resistance
IGBT
Diode
V_ISOL
T_J
T_{ST G}
T_C
Torque
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
To heatsink
M6
Wt Package Weight
SP6-P Package outline (dimensions in mm)
Min Typ Max Unit
0.60 _°C/W
0.98
2500
V
-40
175
-40
125 °C
-40
100
3
5 N.m
250 g
5 places (3:1)
See application note 1902 - Mounting Instructions for SP6-P (12mm) Power Modules on www.microsemi.com
www.microsemi.com
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