APTC60AM45T1G Datasheet, PDF (3/6 Pages) Microsemi Corporation – Phase leg Super Junction MOSFET Power Module

APTC60AM45T1G
Thermal and package characteristics
Symbol Characteristic
Min Typ Max Unit
R_thJC Junction to Case Thermal Resistance
0.5 °C/W
V_ISOL
T_J
T_STG
T_C
Torque
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
To heatsink M4
2500
-40
-40
-40
2.5
V
150
125 °C
100
4.7 N.m
Wt Package Weight
80 g
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol Characteristic
Min Typ
R₂₅ Resistance @ 25°C
B _25/85 T₂₅ = 298.15 K
50
3952
R_T
=
R₂₅

exp_

B₂₅
/
85

1
T₂₅
−
1
T

T: Thermistor temperature
R_T: Thermistor value at T
Max
Unit
kΩ
K
SP1 Package outline (dimensions in mm)
See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com
www.microsemi.com
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