APT60GL120JU2_10 Datasheet, PDF (3/5 Pages) Microsemi Corporation – ISOTOP® Boost chopper Trench + Field Stop IGBT4 Power module

APT60GL120JU2
Thermal and package characteristics
Symbol Characteristic
R_thJC Junction to Case Thermal Resistance
IGBT
Diode
R_thJA
V_ISOL
T_J,T_STG
T_L
Torque
Junction to Ambient (IGBT & Diode)
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Storage Temperature Range
Max Lead Temp for Soldering:0.063” from case for 10 sec
Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine)
Wt Package Weight
Min Typ
2500
-55
29.2
Max Unit
0.53
1.2 ^°C/W
20
V
175
300
°C
1.5 N.m
g
SOT-227 (ISOTOP^®) Package Outline
31.5 (1.240)
31.7 (1.248)
7.8 (.307)
8.2 (.322)
r = 4.0 (.157)
(2 places)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
4.0 (.157)
4.2 (.165)
(2 places)
11.8 (.463)
12.2 (.480)
8.9 (.350)
9.6 (.378)
Hex Nut M4
(4 places)
25.2 (0.992)
0.75 (.030) 12.6 (.496) ^{25.4 (1.000)}
0.85 (.033) 12.8 (.504)
3.3 (.129)
3.6 (.143)
1.95 (.077)
2.14 (.084)
14.9 (.587)
15.1 (.594)
Cathode
Collector
30.1 (1.185)
30.3 (1.193)
38.0 (1.496)
38.2 (1.504)
* Emitter terminals are shorted
internally. Current handling
capability is equal for either
Emitter terminal.
Emitter
Gate
Dimensions in Millimeters and (Inches)
ISOTOP® is a registered trademark of ST Microelectronics NV
www.microsemi.com
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