LX8554-XX Datasheet, PDF (2/7 Pages) Microsemi Corporation – 5A EXTREMELY LOW DROPOUT POSITIVE REGULATORS

LX8554-xx
PRODUCT DATABOOK 1996/1997
5A EXTREMELY LOW DROPOUT POSITIVE REGULATORS
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Power Dissipation .................................................................................. Internally Limited
Input Voltage ................................................................................................................ 10V
Input to Output Voltage Differential ........................................................................... 10V
Operating Junction Temperature
Plastic (P Package) ................................................................................................ 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal.
T H E R MAL DATA
P PACKAGE:
THERMAL RESISTANCE-JUNCTION TO TAB, θ_JT
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ_JA
DD PACKAGE:
2.7°C/W
60°C/W
THERMAL RESISTANCE-JUNCTION TO TAB, θ_JT
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ_JA
2.7°C/W
60°C/W *
Junction Temperature Calculation: T_J = T_A + (P_D x θ_JA).
The θ_JA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
* θ can be improved with package soldered to 0.5IN2 copper area over backside ground
JA
plane or internal power plane. θ_JAcan vary from 20ºC/W to > 40ºC/W depending on
mounting technique.
PACKAGE PIN OUTS
TAB IS V_OUT
3
2
1
V
IN
V
OUT
ADJ / GND*
P PACKAGE
(Top View)
* Pin 1 is GND for fixed voltage versions.
TAB IS V_OUT
3
V
IN
2
V
OUT
1
ADJ / GND*
DD PACKAGE
(Top View)
* Pin 1 is GND for fixed voltage versions.
2
Copyright © 1997
Rev. 1.1 1/97