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| JANTXV1N3595UR-1 Datasheet, PDF (2/2 Pages) Microsemi Corporation – METALLURGICALLY BONDED | |||
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6 Lake Street, Lawrence, MA 01844
1-800-446-1158 / (978) 794-1666 / Fax: (978) 689-0803
Website: http: //www.microsemi.com
TECHNICAL DATA SHEET
PACKAGE DIMENSIONS
NOTE:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimensions are pre-solder dip.
4. Referencing to dimension S, minimum clearance of glass body to
mounting surface on all orientations.
5. In accordance with ASME Y14.5M, diameters are equivalent to Ïx
symbology.
Dimensions
Ltr
Inches
Millimeters Notes
Min Max Min Max
BD .063 .067 1.60 1.70
BL .130 .146 3.30 3.70
ECT .016 .022 0.41 0.55
S
.001 Min
0.03 Min
DESIGN DATA
Case: Hermetically sealed glass package per MIL-PRF-19500/241 DO-213AA outline
Lead Material: Copper clad steel
Lead Finish: Tin / Lead
Thermal Impedance (ZθJX): 70°C/W maximum
Polarity: Cathode end is banded
FIGURE 1. Physical dimensions - 1N3595UR-1, 1N3595AUR-1 (DO-213AA)
LDS-0027 Rev. 3 (100246)
Page 2 of 2
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