GC9001 Datasheet, PDF (2/2 Pages) Microsemi Corporation – PASSIVE DEVICES - Spiral Bias Elements

TM
.
GC9001 – GC9011
®
PASSIVE DEVICES – Spiral Bias Elements
RoHS Compliant
ELECTRICAL PARAMETERS @ 25C
(unless otherwise specified)
Model Number
L(nH)
(Typ)
R_DC(Ohms)
(Typ)
OUTLINE
GC9005
3
1.0
A
GC9001
6
1.5
A
GC9006
10
2.0
B
GC9002
15
2.5
B
GC9007
21
3.5
C
GC9008
28
4.0
C
GC9003
36
5.0
C
GC9009
45
6.0
D
GC9010
55
7.0
D
GC9011
68
8.0
D
GC9004
78
8.5
D
OUTLINE
MECHANICAL DIMENSIONS
Chip
L(A) X W(B)
(Inches)
(Max)
Chip
Thickness(C)
(Inches)
(+/-0.002)
A
0.031” X 0.031"
0.011
B
0.032” X 0.032"
0.011
.
C
0.041” X 0.041"
0.011
D
0.061” X 0.061"
0.011
RECOMMENDED CHIP ATTACHMENT AND LEAD BONDING PROCEDURES
CHIP ATTACHMENT
Chip attachment to hybrid circuits or module bodies can
be accomplished with either conductive or nonconductive
epoxy paste. EPO TEK H-61 or EPO TEK H-20 are
examples of some commonly used epoxy pastes
RIBBON OR WIRE BONDING
Thermo-compression bonding is recommended. A temperature of
175°C with pressure of 25 grams would be adequate for bonding
most gold ribbon or wire. For optimum performance, attach RF
input to pad at center of coil and the bypass network (capacitance)
to outside pad.
Copyright  2007
Rev: 2009-01-19
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: [phone]
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