English
Language : 

APT8DQ60KCT Datasheet, PDF (2/4 Pages) Advanced Power Technology – ULTRAFAST SOFT RECOVERY RECTIFIER DIODE
DYNAMIC CHARACTERISTICS
Symbol Characteristic
Test Conditions
MIN
trr
Reverse Recovery Time IF = 1A, diF/dt = -100A/µs, VR = 30V, TJ = 25°C
-
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Maximum Reverse Recovery Current
-
IF = 8A, diF/dt = -200A/µs
-
VR = 400V, TC = 25°C
-
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Maximum Reverse Recovery Current
-
IF = 8A, diF/dt = -200A/µs
-
VR = 400V, TC = 125°C
-
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Maximum Reverse Recovery Current
-
IF = 8A, diF/dt = -1000A/µs
-
VR = 400V, TC = 125°C
-
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol Characteristic / Test Conditions
MIN
RθJC Junction-to-Case Thermal Resistance
WT
Package Weight
Torque Maximum Mounting Torque
Microsemi reserves the right to change, without notice, the specifications and information contained herein.
APT8DQ60KCT(G)
TYP MAX UNIT
14
ns
19
17
nC
2
-
Amps
90
ns
160
nC
3
-
Amps
43
ns
250
nC
11
Amps
TYP
0.07
1.9
MAX
2.7
10
1.1
UNIT
°C/W
oz
g
lb•in
N•m
3.0
2.5
D = 0.9
2.0
0.7
1.5
0.5
Note:
1.0
0.3
t1
t2
0.5
0.1
SINGLE PULSE
Duty Factor D = t1/t2
0.05
Peak TJ = PDM x ZθJC + TC
0
10-5
10-4
10-3
10-2
10-1
1.0
RECTANGULAR PULSE DURATION (seconds)
FIGURE 1a. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION
TJ (°C)
TC (°C)
Dissipated Power
(Watts)
1.93
0.00078
0.773
0.0246
ZEXT are the external thermal
impedances: Case to sink,
sink to ambient, etc. Set to
zero when modeling only
the case to junction.
FIGURE 1b, TRANSIENT THERMAL IMPEDANCE MODEL