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APT8DQ60K Datasheet, PDF (2/4 Pages) Advanced Power Technology – ULTRAFAST SOFT RECOVERY RECTIFIER DIODE
DYNAMIC CHARACTERISTICS
Symbol Characteristic
Test Conditions
MIN
trr
Reverse Recovery Time IF = 1A, diF/dt = -100A/µs, VR = 30V, TJ = 25°C
-
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Maximum Reverse Recovery Current
-
IF = 8A, diF/dt = -200A/µs
-
VR = 400V, TC = 25°C
-
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Maximum Reverse Recovery Current
-
IF = 8A, diF/dt = -200A/µs
-
VR = 400V, TC = 125°C
-
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Maximum Reverse Recovery Current
-
IF = 8A, diF/dt = -1000A/µs
-
VR = 400V, TC = 125°C
-
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol Characteristic / Test Conditions
MIN
RθJC Junction-to-Case Thermal Resistance
WT
Package Weight
Torque Maximum Mounting Torque
Microsemi reserves the right to change, without notice, the specifications and information contained herein.
APT8DQ60K_SA(G)
TYP MAX UNIT
14
ns
19
17
nC
2
-
Amps
90
ns
160
nC
3
-
Amps
43
ns
250
nC
11
Amps
TYP
0.07
1.9
MAX
2.7
10
1.1
UNIT
°C/W
oz
g
lb•in
N•m
3.0
2.5
D = 0.9
2.0
0.7
1.5
0.5
Note:
1.0
0.3
t1
t2
0.5
0.1
SINGLE PULSE
Duty Factor D = t1/t2
0.05
Peak TJ = PDM x ZθJC + TC
0
10-5
10-4
10-3
10-2
10-1
1.0
RECTANGULAR PULSE DURATION (seconds)
FIGURE 1a. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION
TJ (°C)
TC (°C)
Dissipated Power
(Watts)
1.93
0.00078
0.773
0.0246
ZEXT are the external thermal
impedances: Case to sink,
sink to ambient, etc. Set to
zero when modeling only
the case to junction.
FIGURE 1b, TRANSIENT THERMAL IMPEDANCE MODEL