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APT56M50B2 Datasheet, PDF (2/4 Pages) Microsemi Corporation – APT56M50B2
Static Characteristics
TJ = 25°C unless otherwise specified
Symbol Parameter
Test Conditions
Min
VBR(DSS)
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250µA
500
∆VBR(DSS)/∆TJ Breakdown Voltage Temperature Coefficient
RDS(on)
Drain-Source On Resistance 3
Reference to 25°C, ID = 250µA
VGS = 10V, ID = 28A
VGS(th)
∆VGS(th)/∆TJ
Gate-Source Threshold Voltage
Threshold Voltage Temperature Coefficient
VGS = VDS, ID = 2.5mA
3
IDSS
Zero Gate Voltage Drain Current
VDS = 500V
VGS = 0V
TJ = 25°C
TJ = 125°C
IGSS
Gate-Source Leakage Current
VGS = ±30V
Dynamic Characteristics
Symbol
gfs
Ciss
Crss
Coss
Parameter
Forward Transconductance
Input Capacitance
Reverse Transfer Capacitance
Output Capacitance
TJ = 25°C unless otherwise specified
Test Conditions
Min
VDS = 50V, ID = 28A
VGS = 0V, VDS = 25V
f = 1MHz
Co(cr) 4
Effective Output Capacitance, Charge Related
VGS = 0V, VDS = 0V to 333V
Co(er) 5
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Effective Output Capacitance, Energy Related
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Current Rise Time
Turn-Off Delay Time
Current Fall Time
Co(er) =
-2.04E-7 4.76E-8
+
VD2S
VDS
+ 1.36E-10
VGS = 0 to 10V, ID = 28A,
VDS = 250V
Resistive Switching
VDD = 333V, ID = 28A
RG = 4.7Ω 6 , VGG = 15V
APT56M50B2_L
Typ Max Unit
V
0.60
V/°C
0.085 0.10
Ω
4
5
V
-10
mV/°C
100
µA
500
±100 nA
Typ Max Unit
42
S
8800
120
945
550
pF
275
220
50
nC
100
38
45
ns
100
33
Source-Drain Diode Characteristics
Symbol Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) 1
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
dv/dt
Peak Recovery dv/dt
Test Conditions
MOSFET symbol
showing the
integral reverse p-n
junction diode
(body diode)
D
G
S
ISD = 28A, TJ = 25°C, VGS = 0V
ISD = 28A 3
diSD/dt = 100A/µs, TJ = 25°C
ISD ≤ 28A, di/dt ≤1000A/µs, VDD = 333V,
TJ = 125°C
Min
Typ
660
13.2
Max
100
200
1
8
Unit
A
V
ns
µC
V/ns
1 Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.
2 Starting at TJ = 25°C, L = 3.06mH, RG = 4.7Ω, IAS = 28A.
3 Pulse test: Pulse Width < 380µs, duty cycle < 2%.
4 Co(cr) is defined as a fixed capacitance with the same stored charge as COSS with VDS = 67% of VDSS.
5 Co(er) is defined as a fixed capacitance with the same stored energy as COSS with VDS = 67% of VDSS. The equation in the test conditions
box can be used to calculate Co(er) for any value of VDS less than VDSS.
6 RG is external gate resistance, not including internal gate resistance or gate driver impedance. (MIC4452)
Microsemi reserves the right to change, without notice, the specifications and information contained herein.