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APT15GP60BDL Datasheet, PDF (2/9 Pages) Microsemi Corporation – Resonant Mode Combi IGBT
DYNAMIC CHARACTERISTICS
APT15GP60BDL(G)
Symbol Characteristic
Test Conditions
MIN TYP MAX UNIT
Cies
Input Capacitance
Capacitance
Coes Output Capacitance
VGE = 0V, VCE = 25V
Cres Reverse Transfer Capacitance
f = 1 MHz
VGEP Gate-to-Emitter Plateau Voltage
Gate Charge
Qg
Total Gate Charge 3
Qge
Gate-Emitter Charge
Qgc
Gate-Collector ("Miller ") Charge
VGE = 15V
VCE = 300V
IC = 15A
SSOA Switching Safe Operating Area
TJ = 150°C, RG = 5Ω,VGE =
65
15V, L = 100μH,VCE = 600V
td(on) Turn-on Delay Time
Inductive Switching (25°C)
tr
Current Rise Time
VCC = 400V
td(off)
tf
Eon1
Eon2
Eoff
Turn-off Delay Time
Current Fall Time
Turn-on Switching Energy 4
Turn-on Switching Energy (With Diode) 5
Turn-off Switching Energy 6
VGE = 15V
IC = 15A
RG = 5Ω
TJ = +25°C
td(on) Turn-on Delay Time
Inductive Switching (125°C)
tr
Current Rise Time
VCC = 400V
td(off)
tf
Eon1
Eon2
Eoff
Turn-off Delay Time
Current Fall Time
Turn-on Switching Energy 4 4
Turn-on Switching Energy (With Diode) 55
Turn-off Switching Energy 66
VGE = 15V
IC = 15A
RG = 5Ω
TJ = +125°C
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol Characteristic
MIN
1685
210
15
7.5
55
12
15
8
12
29
58
130
152
121
8
12
69
88
130
267
268
TYP MAX
pF
V
nC
A
ns
μJ
ns
μJ
UNIT
RθJC
RθJC
WT
Junction to Case (IGBT)
Junction to Case (DIODE)
Package Weight
.50
1.00
5.90
°C/W
gm
1 Repetitive Rating: Pulse width limited by maximum junction temperature.
2 For Combi devices, Ices includes both IGBT and diode leakages
3 See MIL-STD-750 Method 3471.
4 Eon1 is the clamped inductive turn-on-energy of the IGBT only, without the effect of a commutating diode reverse recovery current
adding to the IGBT turn-on loss. (See Figure 24.)
5 Eon2 is the clamped inductive turn-on energy that includes a commutating diode reverse recovery current in the IGBT turn-on switching
loss. A Combi device is used for the clamping diode as shown in the Eon2 test circuit. (See Figures 21, 22.)
6 Eoff is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1. (See Figures 21, 23.)
Microsemi reserves the right to change, without notice, the specifications and information contained herein.