1N3611_11 Datasheet, PDF (2/5 Pages) Microsemi Corporation – VOIDLESS-HERMETICALLY-SEALED

6 Lake Street, Lawrence, MA 01841
1-800-446-1158 / [phone] / Fax: [phone]
Website: http://www.microsemi.com
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland
Tel: [phone] Fax: [phone]
APPLICATIONS / BENEFITS
¾ Standard recovery 1 Amp rectifiers 200 to 1000 V
¾ Military and other high-reliability applications
¾ General rectifier applications including bridges, half-bridges, catch diodes, etc.
¾ High forward surge current capability
¾ Extremely robust construction
¾ Low thermal resistance
¾ Controlled avalanche with peak reverse power capability
¾ Inherently radiation hard as described in Microsemi MicroNote 050
MAXIMUM RATINGS
¾ Junction & Storage Temperature: -65^oC to +175^oC
¾ Thermal Resistance: 38^oC/W junction to lead at 3/8 inch (10 mm) lead length from body
¾ Average Rectified Forward Current (I_O): 1.0 Amps @ T_A = 100ºC and 0.30 Amps at 150ºC
¾ Forward Surge Current: 30 Amps @ 8.3 ms half-sine
¾ Solder Temperatures: 260ºC for 10 s (maximum)
MECHANICAL AND PACKAGING
¾ CASE: Hermetically sealed voidless hard glass with Tungsten slugs
¾ TERMINATIONS: Axial leads are copper with Tin/Lead (Sn/Pb) finish
¾ MARKING: Body paint and part number, etc.
¾ POLARITY: Cathode band
¾ TAPE & REEL option: Standard per EIA-296
¾ WEIGHT: 500 mg (approx)
¾ See package dimensions on last page
T4-LDS-0190 Rev. 1 (110047)
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