UPTB28E3 Datasheet, PDF (1/5 Pages) Microsemi Corporation – SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSORS

UPT5e3 – UPT48e3, UPT5Re3 – UPT48Re3
UPTB8e3 – UPTB48e3
Available on
commercial
versions
SURFACE MOUNT TRANSIENT
VOLTAGE SUPPRESSORS
DESCRIPTION
Microsemi’s new Powermite UPT series of transient voltage suppressors feature oxide-passivated
chips with high-temperature solder bonds for high surge capability and negligible electrical
degradation under repeated surge conditions. Both unidirectional and bidirectional configurations
are available. In addition to its size advantages, the Powermite package includes a fully metallic
bottom (cathode) side that eliminates the possibility of solder flux entrapment at assembly and a
unique locking tab serves as an integral heat sink. Its innovative design makes this device fully
compatible for use with automatic insertion equipment. Microsemi also offers numerous other
products to meet higher and lower power voltage regulation applications.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• Powermite package with standoff voltages 5 to 48 V.
• Both unidirectional and bidirectional polarities:
-Anode to case bottom (UPT5e3 thru UPT48e3)
-Cathode to case bottom (UPT5Re3 thru UPT48Re3)
-Bidirectional (UPTB8e3 thru UPTB48e3)
• Clamping time less than 100 pico-seconds for unidirectional and 5 nano-seconds for bidirectional
version.
• Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B.
• RoHS compliant versions available.
APPLICATIONS / BENEFITS
• Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T²L, etc.
• Protection from switching and induced RF transients.
• New improved lower leakage current for the UPT5Re3:
-Integral heat sink / locking tabs
-Fully metallic bottom side eliminates flux entrapment
• Compliant to IEC61000-4-2 and IEC61000-4-4 for ESD and EFT protection respectively.
• Secondary lightning protection per IEC61000-4-5 with 42 Ohms source impedance:
Class 1: UPT5//UPT5R/UPTB8 to17
Class 2: UPT5//UPT5R/UPTB8 to12
MAXIMUM RATINGS
DO-216AA
Package
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Ambient ⁽¹⁾
Thermal Resistance Junction-to-Case (base tab)
Peak Pulse Power (see Figure 1 and Figure 2)
UPT5Re3:
UPT5e3 thru UPT48e3:
UPT8Re3 thru UPT48Re3:
UPTB8e3 thru UPTB48e3:
Steady-State Power Dissipation
(base tab < 112 ^oC)
Impulse Repetition Rate (duty factor)
Solder Temperature @ 10 s
Symbol
T_J /
T_STG
R _Ó¨JA
R _Ó¨JC
P _PP
P_D
T_SP
Notes: 1. When mounted on FR4 PC board with 1 oz copper.
Value
-65 to +150
240
15
@ 8/20 µs @10/1000µs
600
100
1000
150
1000
150
1000
150
2.5
0.01
260
Unit
o_C
o_C/W
o_C/W
W
W
%
o_C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: [phone] or
[phone]
Fax: [phone]
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: [phone]
Fax: [phone]
Website:
www.microsemi.com
T4-LDS-0248, Rev. 1 (120182)
©2012 Microsemi Corporation
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